The Seeed Studio XIAO ESP32S3 Plus is the expanded version of the popular XIAO ESP32S3, designed for advanced IoT projects, smart home devices, and professional wireless products that require additional I/O connectivity. It maintains the signature XIAO thumb-sized form factor at just 21 × 17.8 mm, while adding 9 extra GPIO pads via SMD castellations for board-to-board soldering.
Powered by the ESP32-S3R8 dual-core Xtensa LX7 32-bit processor running at up to 240 MHz, this board delivers strong performance for demanding applications including AI acceleration, wireless communication, and edge computing. The Plus variant upgrades the onboard storage to 16MB Flash (up from 8MB on the standard XIAO ESP32S3), providing more room for complex firmware, OTA updates, and data logging.
The redesigned back-side pad layout and standardized castellations make this board ideal for production-ready SMD integration. Unlike standard XIAO boards that use through-hole headers, the Plus variant offers 23 castellation pins (20 GPIOs + 3 power pins) for direct soldering onto carrier PCBs. This makes it a true System-on-Module (SoM) solution for wearables, space-constrained devices, and commercial products.
Wireless connectivity includes 2.4 GHz Wi-Fi and Bluetooth 5.0 / Bluetooth Mesh, with an included 2.4 GHz rod antenna for extended range. The board supports ultra-low power consumption with a deep sleep current of approximately 14 µA, making it ideal for battery-powered applications. Integrated lithium battery charging management simplifies battery-powered design.
The XIAO ESP32S3 Plus is fully compatible with Arduino, MicroPython, and ESP-IDF, and works with the entire XIAO accessory ecosystem including expansion boards, sensors, and communication modules. Whether you are building an advanced Bluetooth project, a wireless sensor network, or a production-ready wearable device, the XIAO ESP32S3 Plus provides the extra I/O and storage capacity needed for professional applications.
Features
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ESP32-S3R8 dual-core processor — Xtensa LX7 32-bit at up to 240 MHz with vector instructions for AI acceleration
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16MB Flash storage — Doubled capacity vs. standard XIAO ESP32S3 for complex firmware and data logging
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9 extra GPIO castellation pads — Total of 20 GPIOs for expanded connectivity via SMD board-to-board soldering
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Wi-Fi & Bluetooth 5.0 — Complete 2.4 GHz Wi-Fi subsystem with BLE 5.0 and Bluetooth Mesh support
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Ultra-low power consumption — 14 µA deep sleep current with integrated lithium battery charging management
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Production-ready SMD design — Redesigned castellations and back-side pads for professional PCBA integration
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Standardized back layout — Aligned battery and debugger pads compatible with future XIAO expansion boards
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Rich interfaces — 2× UART, 1× IIC, 1× IIS, 2× SPI, 18× GPIO (PWM), 9× ADC
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Compact XIAO form factor — 21 × 17.8 mm with single-sided mounting for wearables
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Broad development support — Arduino, MicroPython, and ESP-IDF compatible
Technical Specifications
| # | Parameter | Specification |
|---|---|---|
| 1 | Processor | ESP32-S3R8, Xtensa LX7 dual-core 32-bit, up to 240 MHz |
| 2 | Memory | 8MB PSRAM + 16MB Flash |
| 3 | Wireless | 2.4 GHz Wi-Fi + Bluetooth 5.0 / Bluetooth Mesh |
| 4 | GPIO Count | 20 total (11 through-hole + 9 SMD castellation) |
| 5 | Interfaces | 2× UART, 1× IIC, 1× IIS, 2× SPI, 18× PWM, 9× ADC |
| 6 | Deep Sleep Current | Approximately 14 µA |
| 7 | Charging Current | 100 mA (fast charge) |
| 8 | Dimensions | 21 × 17.8 mm |
